Experimental Study of Impingement Cooling of Heat Sinks for LSI Packages with Pin-Fin Arrays.
نویسندگان
چکیده
منابع مشابه
Numerical Optimization of Pin-Fin Heat Sink with Forced Cooling
This study presents the numerical simulation of optimum pin-fin heat sink with air impinging cooling by using Taguchi method. 9 L ( 4 3 ) orthogonal array is selected as a plan for the four design-parameters with three levels. The governing equations are discretized by using the control-volume-based-finite-difference method with a power-law scheme on the non-uniform staggered grid. We solved th...
متن کاملHeat Transfer Enhancement of Small Scale Heat Sinks Using Vibrating Pin Fin
Heat sinks are widely adopted in electronics cooling together with different technologies to enhance the cooling process. For the small electronics application, the small scale pin fins heat sinks are extensively used to dissipate heat in electronics devices. Due to the limit of space in the small devices, it is impossible to increase heat transfer area. In order to improve the heat transfer pe...
متن کاملOptimal Shape Design for a Cooling Pin Fin Connection Profil
A shape optimization problem of cooling fins for computer parts and integrated circuits is modeled and solved in this paper. The main purpose is to determine the shape of a two-dimensional pin fin, which leads to the maximum amount of removed heat. To do this, the shape optimization problem is defined as maximizing the norm of the Nusselt number distribution at the boundary of the pin fin's con...
متن کاملComparative Performance of Surrogate-Assisted MOEAs for Geometrical Design of Pin-Fin Heat Sinks
This paper presents the comparative performance of several surrogate-assisted multiobjective evolutionary algorithms MOEAs for geometrical design of a pin-fin heat sink PFHS . The surrogate-assisted MOEAs are achieved by integrating multiobjective population-based incremental learning PBIL with a quadratic response surface model QRS , a radial-basis function RBF interpolation technique, and a K...
متن کاملPurpose, potential and realization of chip-attached micro-pin fin heat sinks
Article history: Received 25 May 2015 Received in revised form 27 June 2015 Accepted 2 July 2015 Available online xxxx
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B
سال: 1995
ISSN: 0387-5016,1884-8346
DOI: 10.1299/kikaib.61.697